Current Notice

Information for visitors

We take all necessary measures to protect our customers, business partners and employees against Coronavirus. If you want to come to us, you should fulfill one of the following criteria:

Vaccinated: Proof of complete vaccination protection has to be submitted, e.g. yellow vaccination certificate. At least 14 days must have passed since the last required vaccination.

Recovered: Proof of a positive PCR test at least 28 days and max. 6 months old is required.

Tested: Negative PCR- or antigen test, max. 48 hrs. old

In general, the following still applies: if you show any symptoms of a possible Covid-19 infection like shortness of breath, cough, fever, loss of smell or taste, please postpone your visit until you feel better or send another person from your organization to the appointment. Our reception will check the appropriate certificate / document (vaccinated, recovered, tested) when you will arrive for your visit. 

Newsroom

News

On July 20, 2021, Thorsten Frei, Deputy Chairman of the CDU/ CSU parliamentary group, visited our headquarters in Donaeschingen-Aasen. "We are looking...

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Highlights

CleanSurF® - with this short film we share with you some impressions of the creation process of the new AP&S cleaner.

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AP&S

Company

We are your partner for wet process equipment

We overcome every obstacle and move even mountains just to reach our aim, which is to keep your wafers clean! Because wet process technology is our passion. We are rooted in the Black Forest and at home in the semiconductor market worldwide. Let's shape the future of the semiconductor production together!

Far-sighted, customer-oriented, innovative - that's AP&S and our wet process solutions, and that's what we have to be. After all, microelectronics, microsystems and nanotechnology - all areas in which our wet process machines are used - are considered to be the strongest innovation drivers of all. The rapid progress exemplified by our customers here is setting standards for economically important cutting-edge technologies such as automation, sensors, the automotive industry, biomedical technology, telecommunications and others worldwide. We are part of this innovation chain and committed to continuous progress.

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SOLUTIONS

Solutions

FULL RANGE OF WET PROCESS SOLUTIONS

Whether a standard wet process tool or a customer-specific solution is required: 
Our modular product spectrum is tailored to your needs!

We deliver advanced, high-performance wet surface treatment equipment to the industry’s leading semiconductor fabs worldwide. The AP&S wet process range includes manual, semi-automated and fully automated wet process equipment for up to 300mm wafers. The AP&S solutions perfectly cover batch as well as single wafer processing. Etch processes, surface conditioning, resist develop, resist strip, metal lift-off, metal etch, electroless metal deposition, wafer cleaning and drying applications are all included in the AP&S portfolio.

Our hardware is perfectly adapted to the requirements of the microstructuring industry: high throughput, innovative and cost-efficient processing, optimized footprint and most reliable process results are the characteristics of the AP&S wet process equipment.

BATCH PROCESSING

High throughput, optimized process running costs, easy and comprehensive process control, consistent deposition results and processing of multiple wafers on both sides at once are the main characteristics of AP&S batch processing tools for the semiconductor devices and microelectromechanical systems (MEMS) manufacturing.

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SINGLE WAFER
PROCESSING

The AP&S single wafer solutions are the right choice for you, when high precision processes with high uniformity, high level of repeatability and significantly precise process control are required.

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SUPPORTING
EQUIPMENT

To ensure efficient wet processes in our customers’ semiconductor fabs is our primary goal. Therefore, supporting equipment like foup and box cleaner, drying tools for wafers, laboratory equipment and chemical management solutions belong to our product range too.

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SERVICES &
SPARE PARTS

The AP&S After Sales Unit provides fast and competent support for customers worldwide, ensuring process reliability and high uptime.

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Applications

Applications

WET PROCESS APPLICATIONS OVERVIEW

AP&S offers innovative wet process technologies for wafer processing in the microchip fabrication process, including cleaning, etching, resist strip, resist development, metal etching, electroless metal deposition for Under Bump Metallization, lift-off and wafer drying technologies. 

With a wide range of modular wet process equipment using various techniques such as immersion, spin and spray AP&S is well positioned to meet the specific needs of the semiconductor industry. 

At the AP&S Demo Center, an in-house laboratory at our German headquarters, we offer wet process demonstrations for wafers, masks and other substrates.

Cleaning

Cleaning processes using ultra high purity chemistries require adequate pure equipment solutions with advanced surface and structural interaction. The hardware design focus is on the cleaning efficiency in variable structures at different aspect ratios.

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Etching

Etch processes for the different SC- materials require hardware optimized to the used high purity etch-chemistries. Low sigma variations of the etched structural dimensions from across chip, across wafer and wafer to wafer are the main target for wafer sizes up to 300mm. The effective removal of the etched materials in the structure is achieved by the optimized hydro-dynamic flow conditions in the equipment and the AP&S dryer concepts contribute to low particulate levels.

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PR Strip

After etching, the pattern is a permanent part of the top layer of the wafer. The resist that has acted as an etch barrier is removed from the surface.

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Developing

The pattern of the resist is developed by the chemical dissolution of the unpolymerized resist region. Development will form in the resist layer a pattern with the exact dimensions designated during the circuit design process.

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Metal Etching

Metal pattern etch technologies for Al, Ti, W and others. Complete removal of metals processes from device- or monitor- wafers for wafers up to 300mm diameter, using hardware tailored to the specific chemistries needed for each metal composite.

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E-Less Plating

Flip chip bonding is of increasing importance to further device miniaturization. Under-bump metallization is deposited in electro-less deposition technology on Al-alloy and Cu- substrates.

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Lift-off

Metal-Lift-Off is a pattering process that eliminates the etch variation component. Wafers are processed through the development step, leaving a hole in the resist layer where a deposited layer is to be located on top of the resist and into the opening.

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Drying

Water surface tension creates a unique condition when wafers are pulled slowly through a water surface. The tension draws the water away from the surface, leaving it dry.

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BENEFITS

Customer Benefits

CUSTOMER IN FOCUS

Making a decision for AP&S means, getting a competent, reliable, long-term partner. We offer you much more than just the required semiconductor equipment:

TRUST

Trust in our competence. As an owner-managed company with a focus on the semiconductor industry and a company history starting in 1995 we offer you extensive experience and reliability. 

EFFICIENCY

Our long-lasting experience in creating customer-oriented automation technology, extensive expertise in chemical wet processing and continuous dialogue with our customers – these three decisive aspects form the basis for the efficiency of our products.

 

INNOVATION

Following our goal of continuous development, we invest more than 10% of our annual turnover in research and development. Thereby, the customer benefit is always our pulse. With innovative wet process solutions we want to support the development of new technologies and in this way contribute to our customers’ success.

PROCESS

Highly trained team of process engineers, continuous development of chemical processes in our in-house laboratory “Demo Center” and several partnerships with renowned institutes and chemical suppliers ensure the high quality and efficiency of our wet processes.

 

R&D

Innovation leader

To live innovation -
is what drives us at AP&S

Based on the requirements of the semiconductor industry, we follow the principle of continuous development and improvement. Therefore, we invest more than 10% of our annual turnover in research and development. The customer benefit is always our pulse. Which means, by supplying innovative wet process technologies we strive to meet optimally current and future market needs and to contribute to our customers’ success.

Innovation

AP&S has already received several innovation awards: including Top 100 Award 2018, 2019 and 2021 as well as Infineon's Supplier Award Best Innovation 2018. 

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Demo Center

Wet process equipment demonstrations, test reports, complete parameters of the process set-up, recommendations for the process recipe, analyzes and further system configuration details, is what you receive in our in-house laboratory, the Demo Center.  

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IoT & Smart Manufacturing

With the software company tepcon, our affiliated company, we have a strong partner, who develops effective and unique solutions in the field of digitization: intelligent machine functions and process controls in our wet process equipment are the results.

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Career

Career

WORKING AT AP&S

We are a team-oriented company, that promotes the independence and creativity of its employees, is breaking new ground, advancing the development of our staff and is looking beyond regional borders thanks to our international orientation. Our working style is characterized by open communication, transparent processes and quick decision-making achieved by a flat hierarchical structure and short communication channels. The community of our employees is the driving force behind our success. It is the individuality and dedication of each individual, that intermesh seamlessly like pieces of a puzzle and create the modern and dynamic working structures of our company.