In the movie we accompanied the new cleaner from the very beginning until its delivery. The new AP&S cleaner for the semiconductor production offers optimum particle and AMS removal on SMIFs and FOUPs, carriers and boxes. The cleaner offers high loading capacity of up to 12 x 12 inch FOUPs per run at optimized recipe time. Attractive TCO through compact footprint of 3 m² and low consumption of water and nitrogen are achieved. A new innovative nozzle concept guarantees optimum cleaning results. More than 50 nozzles (DIW as well as N2 nozzles) are installed in the tool .
Requests for more information or for a personal talk about the new AP&S cleaning tool can be sent to the AP&S sales team.