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Tobias Bausch interviewed by Silicon Semiconductor

Tobias Bausch, CMO & CTO of AP&S, was interviewed by Phil Alsop of Silicon Semiconductor Magazine about the company's technological innovations.

The focus was on batch and single wafer processing equipment as well as production support equipment that deliver cost-effective, operationally optimised and sustainable customer solutions. The discussion also covered current industry challenges, including supply chain issues and skills shortages, as well as opportunities presented by emerging markets.

The interview with Phil Alsop was a great opportunity for Tobias Bausch to discuss AP&S technologies and challenges - thank you for inviting us!