The core topics of the AP&S cover story in the Silicon Semiconductor Issue IV 2019 are the use of AI in wet process equipment, the possibilities for customers and their benefits provided by our extended Demo Center as well as the unique AP&S e-less wet bench Vulcanio, which has been specially designed and optimized for UBM (Under Bumping Metallization) of Aluminum or Copper pads (Nickel, Palladium, Immersion Gold).
Furthermore, the story has been published in Mandarin in the magazine Silicon Semiconductor China I 2020, which offers our local customers and interested parties even more insight into AP&S and our latest developments. China as an important semiconductor market is correspondingly important for AP&S. Since 2007 our subsidiary in Shanghai has been offering customers local proximity, fast service and competent support.
Enjoy reading the articles: AP&S story in English; AP&S story in Mandarin;
The full versions of the magazines can be found here: Silicon Semiconductor Issue IV 2019; Silicon Semiconductor China I 2020
