Whether a standard wet process tool or a customer-specific solution is required: Our modular product spectrum is tailored to your requirements!
The AP&S product range includes manual, semi-automated and fully automated wet process equipment for the semiconductor-, MEMS- and micro-structuring industries as well as the R&D sector.
Our extensive wet chemical process portfolio covers etch processes, surface conditioning, resist develop, resist strip, metal lift-off, metal etch, electroless metal deposition, wafer cleaning and drying applications.
We offer you wet process equipment for batch processing and single wafer processing as well as supporting semiconductor equipment like foup and box cleaner, laboratory equipment and chemical management systems. AP&S equipment is used in front-end-of-line (FEOL) and back-end-of-line (BEOL) processes.
The AP&S wet process equipment handles masks and wafers up to 12” / 300mm, including different wafer material like silicium Si, silicium carbid SiC, gallium nitrid GaN, gallium arsenid GaAs, sapphire, glass. AP&S wet process tools are suitable for different substrate thicknesses.
High throughput, optimized process running costs, easy and comprehensive process control, consistent deposition results and processing of multiple wafers on both sides at once are the main characteristics of AP&S batch processing tools for the semiconductor devices and microelectromechanical systems (MEMS) manufacturing.
The AP&S single wafer solutions are the right choice for you, when high precision processes with high uniformity, high level of repeatability and significantly precise process control are required.
FOUP, SMIF, carrier and box cleaner, drying tools for wafers, laboratory equipment and chemical management systems belong to our portfolio too.
High throughput, optimized process running costs, easy and comprehensive process control, consistent deposition results and processing of multiple wafers on both sides at once are the main characteristics of AP&S batch processing tools for the semiconductor devices and microelectromechanical systems (MEMS) manufacturing. The AP&S batch processing portfolio includes basic manual wet benches for laboratories or R&D purposes as well as fully-automatic high-end technology benches for high volume production. Due to the perfectly tuned interaction between our product design, automation and required chemicals our wet process solutions for batch processing offer process reliability, optimized process times, cost-efficiency and highest flexibility for the customer. The AP&S wet benches perform cleaning, drying, etching, metal etching, electroless plating, PR strip and metal lift-off processes for wafers up to 12” and masks.
The AP&S single wafer solutions are the right choice for you, when high precision processes with high uniformity, high level of repeatability and significantly precise process control are required. The AP&S single wafer processing portfolio covers a variety of processes for the semiconductor and MEMS production chain: cleaning, drying, etching, metal etching, PR strip and metal lift-off. Our equipment for horizontal wafer handling is able to process all standard sizes of substrates: 100mm, 125mm, 150mm, 200mm and 300mm. The AP&S in-house laboratory, called Demo Center, offers you a wide spectrum of single wafer process demonstrations.
To ensure efficient wet processes in our customers’ semiconductor fabs is our primary goal. Therefore, supporting equipment like foup and box cleaner, drying tools for wafers, laboratory equipment and chemical management solutions belong to our product range too. In this way, our customers receive everything they need from one single source and have a competent partner for all relevant concerns about wet chemical processes by their side.
Handling wafers and substrates within cleanrooms in the semiconductor fabs consists of numerous steps and critical processes, which have to be optimally coordinated in order to obtain high-quality results. Wet processing is certainly just one of these many steps, but one that decisively influences quality. AP&S makes a significant contribution by helping to ensure the stability and purity of wafers and substrates. Our wet process tools make sure that no residues or unwanted particles remain on wafer surfaces; we also prevent unintentional mixing of chemicals and in this way we create a clean basis for further processing.
Alexandra Läufer-Müller, CEO
AP&S International GmbH
Obere Wiesen 9 - Aasen
78166 Donaueschingen
Germany
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