Batch Processing of wafers in the semiconductor production

Efficient drying tool for wafers up to 300mm, thin wafers, ICs, MEMS, LED, photomasks and glass substrates

Main Benefits

• One drying tool for different substrates 
  wafer thickness from 120 to 2000µm 
  without modification
• Available as a stand-alone unit or integrated in a wet bench
• Average process time 10 - 15 minutes*
• Tool demonstration in the AP&S Demo Center is available

Wafer sizes up to 12”

Substrates

Wafers, MEMS, optoelectronics, photomasks, glass substrates

Material configuration:

Si, SiC, GaN, GaAs, Sapphire, Glass

Chemical wet processes

Drying processes with IPA and Hot-N2

Important technical features

• For high or low profile cassettes
• Low IPA consumption: ≤ 30 ml / run
• Ideally suited for thin wafers
• Complies with: CE, SemiS2 and S8, FM 4910, SECS/GEM
• Proven reliability:
  MTBF ≥ 800 h
  Uptime ≥ 97 %

NID loading capacity

• NID Dryer slim
  100–200mm: single cassette or double cassettes
  300mm: single cassette
• NID Dryer big (high throughput)
  100–200mm: up to 4 cassettes (100 wafer)
  300mm: up to 2 cassettes

*depends on customer’s product and technology

Semi-automated wet bench for wafers up to 200mm with a small footprint and a wide range of configuration options

Main Benefits

• Smart, modular construction for comfortable and cost-efficient installation and maintenance as well as for high flexibility regarding upgrades
• Multi wafer-sizes (100–200mm) and -thickness (110µm–2000µm) processing without tool modification
• Superior reliability with an uptime of ≥ 97 %

Wafer sizes up to 8”

Substrates

Wafers, MEMS, optoelectronics, photomasks, glass substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Chemical wet processes

• Different wet cleaning processes
• RCA
• Pre-Diffusion clean
• Various etching processes, including oxide, nitride, poly crystalline, metals and silicides

Important technical features

• Optimized footprint
• Tool configuration is cost-efficiently adjustable according to future product / process changes and customer needs
• Processes 2 x 25-wafer batches of 100–150mm 
  or 1 x 25-wafer batch of 200mm substrates
• Complies with: FM 4910, SEMI S2 and S8, SECS, GEM, CE
• Process control via latest software technology:
  sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes
• Singular mechanical agitation feature in each module

Innovative, fully automated platform, including multi wafer-sizes and -thickness processing

Main Benefits

• Multi wafer-thickness processing from 40 to 200µm, 
  TAIKO up to 2000 µm, double stacked wafers
• Chemistry and solvent processes combined in one tool possible
• Different cassette profiles (high or low)

Wafer sizes up to 12”

Substrates

Wafers

Wafer material

Si, GaN

Chemical wet processes

• Different wet cleaning processes
• RCA
• Solvent applications
• Solvent applications combined in one tool with chemical applications
• Pre-Diffusion clean
• Various etching processes, including oxide, nitride, poly crystalline, metals and silicides

Important technical features

• FOUP system suitable (300mm)
• SMIF system suitable (200mm)
• Processes 25/50 wafer batches
• Automatic loading station incl. thin wafer handling
• Dry-in -> Dry-out processing
• Cassette buffer
• Automatic loading by robot system or OHT possible
• Complies with: FM 4910, SEMI S2 and S8, SECS, GEM, CE
• Process control via latest software technology:
  sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes

Fully automated electroless plating tool for wafers up to 300mm

Vulcanio is a fully automated 300mm wet bench for eless plating with nickel, palladium and gold. Here you can watch our Vulcanio movie. Read the Vulcanio special: Advanced under bump metallization with AP&S e-less bench Vulcanio – 7 unbeatable facts that convince.

Main Benefits

• Specially designed and optimized for UBM (Under Bumping Metallization) of Aluminium or Copper pads (Nickel, Palladium, Immersion Gold)
• Unique software and hardware features ensure excellent deposition uniformity, bath durability and unbeatable cost of ownership ratio
• Process-tailored analyzers and optimized dosage provide comprehensive process control and highest reliability 
• Advanced eless and pretreatment bathes control

Wafer size 6”, 8" and 12”

Substrates

Wafers

Wafer material

Si, SiC, GaN

Chemical wet processes

• Electroless UBM for AL and Cu pads (Ni Nickel, Pd Palladium, Au Immersion Gold)
• Different wafer thicknesses incl. extra-thin wafers and TAIKO can be processed without any tool modification
• OPA: 15–170 % open plating area possible

Important technical features

• Fully automated wet bench for wafer treatment 
• FOUP system suitable (300mm)
• SMIF system suitable (150, 200mm)
• Processes 25 or 50 wafer batches of 150–300mm wafers
• Operates with high- and low-profile cassettes
• Dry-in -> Dry-out processing
• Complies with: FM 4910, SEMI S2 and S8, SECS, GEM, CE
• Process control via latest software technology:
  sensor - software interface, suitable to in-house tracking system, extensive process documentation (consumption, media, temperature, cleaning cycles, end of run, log in), individual recipes

Eless-Plating

Since 2009 AP&S eless equipment is used for under bump metallization in batch processes for mass-volume production. Due to increasing requirements on process performance various optimizations were done to meet future requirements on chip designs. By modification of key features for hydrodynamic behaviour of electrolyte solution within the process tank, deposition uniformity has been significantly improved. This year (2020) the tool design has been profoundly changed and new technical features were added.