High throughput, optimized process running costs, easy and comprehensive process control, consistent deposition results and processing of multiple wafers on both sides at once are the main characteristics of AP&S batch processing tools for the semiconductor devices and microelectromechanical systems (MEMS) manufacturing.
The AP&S batch processing portfolio includes basic manual wet benches for laboratories or R&D purposes as well as fully-automatic high-end technology benches for high volume production. Due to the perfectly tuned interaction between our product design, automation and required chemicals our wet process solutions for batch processing offer process reliability, optimized process times, cost-efficiency and highest flexibility for the customer.
The AP&S wet benches perform cleaning, drying, etching, metal etching, electroless plating, PR strip and metal lift-off processes for wafers up to 12” and masks.
Wafers, MEMS, optoelectronics, photomasks, glass substrates
Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz
Wafers, MEMS, optoelectronics, photomasks, glass substrates
Si, SiC, GaN, GaAs, Sapphire, Glass
Drying processes with IPA and Hot-N2
*depends on customer’s product and technology
Wafers, MEMS, optoelectronics, photomasks, glass substrates
Si, SiC, GaN, GaAs, Sapphire, Glass
Wafers, MEMS, optoelectronics, photomasks, glass substrates
Si, SiC, GaN, GaAs, Sapphire, Glass
Wafers, MEMS, optoelectronics, photomasks, glass substrates
Si, SiC, GaN, GaAs, Sapphire, Glass
Wafers
Si, GaN
Wafers
Si, SiC, GaN, GaAs, Sapphire, Glass
*depends on process
Vulcanio is a fully automated 300mm wet bench for eless plating with nickel, palladium and gold. Here you can watch our Vulcanio movie. Read the Vulcanio special: Advanced under bump metallization with AP&S e-less bench Vulcanio – 7 unbeatable facts that convince.
Wafers
Si, SiC, GaN
Since 2009 AP&S eless equipment is used for under bump metallization in batch processes for mass-volume production. Due to increasing requirements on process performance various optimizations were done to meet future requirements on chip designs. By modification of key features for hydrodynamic behaviour of electrolyte solution within the process tank, deposition uniformity has been significantly improved. This year (2020) the tool design has been profoundly changed and new technical features were added.
“Semiconductor manufacturing is constantly changing, which is a reason that AP&S invests heavily in the development of our portfolio. With AP&S the semiconductor and MEMS producers have a reliable supplier offering them everything they need for effective surface treatment of wafers and other substrates.”
Tobias Bausch, CMO & CTO