The AP&S single wafer solutions are the right choice for you, when high precision processes with high uniformity, high level of repeatability and significantly precise process control are required. The AP&S single wafer processing portfolio covers a variety of processes for the semiconductor and MEMS production chain: cleaning, drying, etching, metal etching, PR strip and metal lift-off. Our equipment for horizontal wafer handling is able to process all standard sizes of substrates: 100mm, 125mm, 150mm, 200mm and 300mm. The AP&S in-house laboratory, called Demo Center, offers you a wide spectrum of single wafer process demonstrations.
Wafers, MEMS, optoelectronics, photomasks, up to 9” and square substrates
Si, SiC, GaN, GaAs, Sapphire, Glass
Cleaning, Etching, Drying, Lift-off, Developing, Metal etching and customized applications
1. Less over-processing time for complete layer etching needed (i.e. over-etching)
2. Less undercut / attack on other layers
3. Stable wafer-to-wafer uniformity
4. Substantial reduction of chemical consumption
Wafers, MEMS, optoelectronics, photomasks, up to 9” and square substrates
Si, SiC, GaN, GaAs, Sapphire, Glass
FEOL etching, BEOL etching and cleaning, Wafer thinning, Stress relief, Film and damage removal
Wafers, MEMS, optoelectronics, photomasks, up to 9” and square substrates
Si, SiC, GaN, GaAs, Sapphire, Glass
Photomasks
Sapphire, Glass
1. Less over-processing time for complete layer etching needed (i.e. over-etching)
2. Less undercut / attack on other layers
3. Stable wafer-to-wafer uniformity
4. Substantial reduction of chemical consumption
Wafers, MEMS, optoelectronics, photomasks, up to 9” and square substrates
Si, SiC, GaN, GaAs, Sapphire, Glass
Wafers, MEMS, optoelectronics, square substrates
Si, SiC, GaN, GaAs, Sapphire, Glass
SC1 (Standard clean 1), SC2 (Standard clean 2), SPM (Piranha etch / clean), dHF
Wafers, MEMS, optoelectronics, square substrates
Si, SiC, GaN, GaAs, Sapphire, Glass
“Our aim is to cover the full range of wet process solutions, that are required across both front- and back-end production chains. Together with our customers we steadily develop new, outstanding processes, like e.g. the AP&S metal lift-off process, which is unique in today’s market.”
Alexandra Laufer-Müller, CEO