Single wafer processing tools for semiconductor industry

AP&S unique metal lift-off solution using DMSO and MegaSonic

Main Benefits

• Unique process performance, without impact on substrate and structures (without the use of high pressure) 
• Complete metal layer lift-off within less 30 seconds
• Cost efficient process: reclaim of process chemicals and of precious metal
• Use of DMSO (dimethyl sulfoxide), an EH&S uncritical substance (EU & US)
• Optimized process time with a positive impact to the overall throughput 
• Tool demonstration in the AP&S Demo Center is available

Wafer sizes up to 12”

Substrates

Wafers, MEMS, optoelectronics, photomasks, up to 9” and square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Chemical wet processes

• The AP&S metal lift-off solution is available for all types of metal layers, alloys and further protection layers used in the semiconductor industry like Au, Ag, AlCu, etc.
• Metal Lift-off, PR-stripping

Important technical features

• High safety for workers, environment and equipment
• MegaSonic Agitation with field proven MegaSonic system
• Effective DIW-rinse by optional high pressure DIW-nozzle
• Solvent (e.g. IPA) rinse is available
• Easy to configure and flexibly upgradeable because of the modular design
• Optimized footprint, easy move-in procedure and hook-up

Metal etch tool using endpoint detection for high level process control

Main Benefits   

• Endpoint detection for highest reliability and process control:

           1. Less over-processing time for complete layer etching needed (i.e. over-etching)

           2. Less undercut / attack on other layers

           3. Stable wafer-to-wafer uniformity

           4. Substantial reduction of chemical consumption 

• Up to 6 different etching media
• Backside protection of wafers
• Tool demonstration in the AP&S Demo Center is available

Wafer sizes up to 12”

Substrates

Wafers, MEMS, optoelectronics, photomasks, up to 9” and square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Wet chemical processes

• The SpinMetal tool is suitable for metal stack etching for the following materials:     
  NickelChrome, Nickel, Copper, Cobalt, Aluminium, Gold, Titanium, Titanium Tungsten, Silver, Bismuth antimonide and other
• Etching of several metal layers in one etching recipe with endpoint detection and control 

Important technical features

• Easy to configure and flexibly upgradeable because of the modular design
• Maximum safety for workers, equipment and environment according to highest safety standards
• Optimized footprint, easy move-in procedure
• No expensive space for our mini chemical management system within the cleanroom is required, as this can be positioned outside

Single wafer wet process tool for efficient particle removal at wafers, MEMS, photomasks and optoelectronics surfaces

Main Benefits

• Optimized CoC by low chemical and water consumption: chemical recirculation and recycling included
• Cleaning of the wafer’s front- and backside in parallel is possible
• Thin wafer handling
• Up to two different cleaning media in one process bowl
• Tool demonstration in the AP&S Demo Center is available

Wafer size up to 12"

Substrates

Wafers, MEMS, optoelectronics, square substrates

Wafer material

Si, SiC, GaN, GaAs, Sapphire, Glass

Wet chemical processes

• Post grind
• Post polish
• Post CMP
• Backside
• Reclaim
• Bevel clean
• TSV cleaning

Important technical features

• Easy to configure and flexibly upgradeable because of the modular design
• Maximum safety for workers, equipment and environment according to highest safety standards
• Optimized footprint, easy move-in procedure
• No expensive space for our mini chemical management system within the cleanroom is required, as this can be positioned outside
• Customer specific cleaning media on request